實驗室

Electronic Packaging Lab

  • 指導教授:
  • E-mail:
  • 地址:R3005
  • 電話:
實驗室簡介

The Electronic Packaging Lab equipped with the necessary devices to carry out the mechanical reliability tests of the electronic products are well established. For example, Laser Doppler Vibrometer can be used to measure natural frequencies and vibration modes of the tested object. There are also thermal impact/thermal circulation test facilities for electronic products; universal tension tester with temperature control capable of testing the material and fatigue properties of electronic products under various temperatures; Drop/Impact Tester for testing the drop resistance of portable electronic products.

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